Mechanical packaging, power, and cooling design for the IBM z13

John G. Torok, Frank E. Bosco, Gary F. Goth, John J. Loparco, M. T. Peets, D. Porter, S. G. Shevach, B. C. Tucker, A. C. VanDeventer, X. Wei, P. A. Wendling, Y. Yu, R. J. Zoodsma. Mechanical packaging, power, and cooling design for the IBM z13. IBM Journal of Research and Development, 59(4/5), 2015. [doi]

Abstract

Abstract is missing.