Design of Test Modules for the Analysis of MCM Interconnects

Claudio Truzzi, Eric Beyne, Edwin Ringoot. Design of Test Modules for the Analysis of MCM Interconnects. In 1996 European Design and Test Conference, ED&TC 1996, Paris, France, March 11-14, 1996. pages 614, IEEE Computer Society, 1996. [doi]

Abstract

Abstract is missing.