Menglin Tsai, Amy Klooz, Alexander Leonard, Jennie Appel, Paul Franzon. Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-8, IEEE, 2009. [doi]
@inproceedings{TsaiKLAF09,
title = {Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC},
author = {Menglin Tsai and Amy Klooz and Alexander Leonard and Jennie Appel and Paul Franzon},
year = {2009},
doi = {10.1109/3DIC.2009.5306569},
url = {http://dx.doi.org/10.1109/3DIC.2009.5306569},
tags = {testing},
researchr = {https://researchr.org/publication/TsaiKLAF09},
cites = {0},
citedby = {0},
pages = {1-8},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009},
publisher = {IEEE},
}