Menglin Tsai, Amy Klooz, Alexander Leonard, Jennie Appel, Paul Franzon. Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-8, IEEE, 2009. [doi]
Abstract is missing.