Analysis and solution to overcome EOS failure induced by latchup test in a high-voltage integrated circuits

Hui-Wen Tsai, Ming-Dou Ker, Yi-Sheng Liu, Ming-Nan Chuang. Analysis and solution to overcome EOS failure induced by latchup test in a high-voltage integrated circuits. In 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013. pages 1-4, IEEE, 2013. [doi]

@inproceedings{TsaiKLC13,
  title = {Analysis and solution to overcome EOS failure induced by latchup test in a high-voltage integrated circuits},
  author = {Hui-Wen Tsai and Ming-Dou Ker and Yi-Sheng Liu and Ming-Nan Chuang},
  year = {2013},
  doi = {10.1109/VLDI-DAT.2013.6533803},
  url = {http://dx.doi.org/10.1109/VLDI-DAT.2013.6533803},
  researchr = {https://researchr.org/publication/TsaiKLC13},
  cites = {0},
  citedby = {0},
  pages = {1-4},
  booktitle = {2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013},
  publisher = {IEEE},
  isbn = {978-1-4673-4435-7},
}