13.1 A fully integrated multimode front-end module for GSM/EDGE/TD-SCDMA/TD-LTE applications using a Class-F CMOS power amplifier

Ming-Da Tsai, Chien-Cheng Lin, Ping-Yu Chen, Tao-Yao Chang, Chien-Wei Tseng, Lai-Ching Lin, Chris Beale, Bosen Tseng, Bernard Tenbroek, Chinq-Shiun Chiu, Guang-Kaai Dehng, George Chien. 13.1 A fully integrated multimode front-end module for GSM/EDGE/TD-SCDMA/TD-LTE applications using a Class-F CMOS power amplifier. In 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017, San Francisco, CA, USA, February 5-9, 2017. pages 216-217, IEEE, 2017. [doi]

Authors

Ming-Da Tsai

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Chien-Cheng Lin

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Ping-Yu Chen

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Tao-Yao Chang

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Chien-Wei Tseng

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Lai-Ching Lin

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Chris Beale

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Bosen Tseng

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Bernard Tenbroek

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Chinq-Shiun Chiu

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Guang-Kaai Dehng

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George Chien

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