Ming-Da Tsai, Chien-Cheng Lin, Ping-Yu Chen, Tao-Yao Chang, Chien-Wei Tseng, Lai-Ching Lin, Chris Beale, Bosen Tseng, Bernard Tenbroek, Chinq-Shiun Chiu, Guang-Kaai Dehng, George Chien. 13.1 A fully integrated multimode front-end module for GSM/EDGE/TD-SCDMA/TD-LTE applications using a Class-F CMOS power amplifier. In 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017, San Francisco, CA, USA, February 5-9, 2017. pages 216-217, IEEE, 2017. [doi]
@inproceedings{TsaiLCCTLBTTCDC17,
title = {13.1 A fully integrated multimode front-end module for GSM/EDGE/TD-SCDMA/TD-LTE applications using a Class-F CMOS power amplifier},
author = {Ming-Da Tsai and Chien-Cheng Lin and Ping-Yu Chen and Tao-Yao Chang and Chien-Wei Tseng and Lai-Ching Lin and Chris Beale and Bosen Tseng and Bernard Tenbroek and Chinq-Shiun Chiu and Guang-Kaai Dehng and George Chien},
year = {2017},
doi = {10.1109/ISSCC.2017.7870338},
url = {http://dx.doi.org/10.1109/ISSCC.2017.7870338},
researchr = {https://researchr.org/publication/TsaiLCCTLBTTCDC17},
cites = {0},
citedby = {0},
pages = {216-217},
booktitle = {2017 IEEE International Solid-State Circuits Conference, ISSCC 2017, San Francisco, CA, USA, February 5-9, 2017},
publisher = {IEEE},
isbn = {978-1-5090-3758-2},
}