Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes

M.-Y. Tsai, C. W. Ting, C.-Y. Huang, Yi-Shao Lai. Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. Microelectronics Reliability, 51(3):642-648, 2011. [doi]

Authors

M.-Y. Tsai

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C. W. Ting

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C.-Y. Huang

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Yi-Shao Lai

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