M.-Y. Tsai, C. W. Ting, C.-Y. Huang, Yi-Shao Lai. Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. Microelectronics Reliability, 51(3):642-648, 2011. [doi]
@article{TsaiTHL11, title = {Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes}, author = {M.-Y. Tsai and C. W. Ting and C.-Y. Huang and Yi-Shao Lai}, year = {2011}, doi = {10.1016/j.microrel.2010.10.009}, url = {http://dx.doi.org/10.1016/j.microrel.2010.10.009}, tags = {C++}, researchr = {https://researchr.org/publication/TsaiTHL11}, cites = {0}, citedby = {0}, journal = {Microelectronics Reliability}, volume = {51}, number = {3}, pages = {642-648}, }