M.-Y. Tsai, C. W. Ting, C.-Y. Huang, Yi-Shao Lai. Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. Microelectronics Reliability, 51(3):642-648, 2011. [doi]
@article{TsaiTHL11,
title = {Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes},
author = {M.-Y. Tsai and C. W. Ting and C.-Y. Huang and Yi-Shao Lai},
year = {2011},
doi = {10.1016/j.microrel.2010.10.009},
url = {http://dx.doi.org/10.1016/j.microrel.2010.10.009},
tags = {C++},
researchr = {https://researchr.org/publication/TsaiTHL11},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {51},
number = {3},
pages = {642-648},
}