Hideaki Tsuchiya, Naohito Suzumura, Ryuji Shibata, Hideki Aono, Makoto Ogasawara, Toshihiko Akiba, Kenji Sakata, Kazuyuki Nakagawa, Takuo Funaya. Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression. In IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019. pages 1-6, IEEE, 2019. [doi]
@inproceedings{TsuchiyaSSAOASN19,
title = {Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression},
author = {Hideaki Tsuchiya and Naohito Suzumura and Ryuji Shibata and Hideki Aono and Makoto Ogasawara and Toshihiko Akiba and Kenji Sakata and Kazuyuki Nakagawa and Takuo Funaya},
year = {2019},
doi = {10.1109/IRPS.2019.8720501},
url = {https://doi.org/10.1109/IRPS.2019.8720501},
researchr = {https://researchr.org/publication/TsuchiyaSSAOASN19},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019},
publisher = {IEEE},
isbn = {978-1-5386-9504-3},
}