Hideaki Tsuchiya, Naohito Suzumura, Ryuji Shibata, Hideki Aono, Makoto Ogasawara, Toshihiko Akiba, Kenji Sakata, Kazuyuki Nakagawa, Takuo Funaya. Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression. In IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019. pages 1-6, IEEE, 2019. [doi]
Abstract is missing.