An electrical-level superposed-edge approach to statistical serial link simulation

Michael J. Tsuk, Daniel Dvorscak, Chin Siong Ong, Jacob White. An electrical-level superposed-edge approach to statistical serial link simulation. In 2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA. pages 717-724, IEEE, 2009. [doi]

Authors

Michael J. Tsuk

This author has not been identified. Look up 'Michael J. Tsuk' in Google

Daniel Dvorscak

This author has not been identified. Look up 'Daniel Dvorscak' in Google

Chin Siong Ong

This author has not been identified. Look up 'Chin Siong Ong' in Google

Jacob White

This author has not been identified. Look up 'Jacob White' in Google