Michael J. Tsuk, Daniel Dvorscak, Chin Siong Ong, Jacob White. An electrical-level superposed-edge approach to statistical serial link simulation. In 2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA. pages 717-724, IEEE, 2009. [doi]
@inproceedings{TsukDOW09,
title = {An electrical-level superposed-edge approach to statistical serial link simulation},
author = {Michael J. Tsuk and Daniel Dvorscak and Chin Siong Ong and Jacob White},
year = {2009},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5361218},
tags = {systematic-approach},
researchr = {https://researchr.org/publication/TsukDOW09},
cites = {0},
citedby = {0},
pages = {717-724},
booktitle = {2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA},
publisher = {IEEE},
}