On the Risk of Fault Coupling over the Chip Substrate

Peter Tummeltshammer, Andreas Steininger. On the Risk of Fault Coupling over the Chip Substrate. In Antonio Núñez, Pedro P. Carballo, editors, 12th Euromicro Conference on Digital System Design, Architectures, Methods and Tools, DSD 2009, 27-29 August 2009, Patras, Greece. pages 325-332, IEEE Computer Society, 2009. [doi]

Authors

Peter Tummeltshammer

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Andreas Steininger

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