Peter Tummeltshammer, Andreas Steininger. On the Risk of Fault Coupling over the Chip Substrate. In Antonio Núñez, Pedro P. Carballo, editors, 12th Euromicro Conference on Digital System Design, Architectures, Methods and Tools, DSD 2009, 27-29 August 2009, Patras, Greece. pages 325-332, IEEE Computer Society, 2009. [doi]
@inproceedings{TummeltshammerS09-1,
title = {On the Risk of Fault Coupling over the Chip Substrate},
author = {Peter Tummeltshammer and Andreas Steininger},
year = {2009},
doi = {10.1109/DSD.2009.185},
url = {http://doi.ieeecomputersociety.org/10.1109/DSD.2009.185},
researchr = {https://researchr.org/publication/TummeltshammerS09-1},
cites = {0},
citedby = {0},
pages = {325-332},
booktitle = {12th Euromicro Conference on Digital System Design, Architectures, Methods and Tools, DSD 2009, 27-29 August 2009, Patras, Greece},
editor = {Antonio Núñez and Pedro P. Carballo},
publisher = {IEEE Computer Society},
isbn = {978-0-7695-3782-5},
}