Taiki Uemura, Byungjin Chung, Jeongmin Jo, Hai Jiang, Yongsung Ji, Tae-Young Jeong, Rakesh Ranjan, Seungbae Lee, Hwasung Rhee, Sangwoo Pae, Euncheol Lee, Jaehee Choi, Shota Ohnishi, Ken Machida. Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM. In 2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020. pages 1-4, IEEE, 2020. [doi]
@inproceedings{UemuraCJJJJRLRP20,
title = {Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM},
author = {Taiki Uemura and Byungjin Chung and Jeongmin Jo and Hai Jiang and Yongsung Ji and Tae-Young Jeong and Rakesh Ranjan and Seungbae Lee and Hwasung Rhee and Sangwoo Pae and Euncheol Lee and Jaehee Choi and Shota Ohnishi and Ken Machida},
year = {2020},
doi = {10.1109/IRPS45951.2020.9129331},
url = {https://doi.org/10.1109/IRPS45951.2020.9129331},
researchr = {https://researchr.org/publication/UemuraCJJJJRLRP20},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020},
publisher = {IEEE},
isbn = {978-1-7281-3199-3},
}