Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits - researchr publication authors

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Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim. Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. In 60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023. pages 1-6, IEEE, 2023. [doi]

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