Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim. Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. In 60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023. pages 1-6, IEEE, 2023. [doi]
@inproceedings{VannaIampikulZEKAGRL23,
title = {Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits},
author = {Pruek Vanna-Iampikul and Lingjun Zhu and Serhat Erdogan and Mohanalingam Kathaperumal and Ravi Agarwal and Ram Gupta and Kevin Rinebold and Sung Kyu Lim},
year = {2023},
doi = {10.1109/DAC56929.2023.10247949},
url = {https://doi.org/10.1109/DAC56929.2023.10247949},
researchr = {https://researchr.org/publication/VannaIampikulZEKAGRL23},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023},
publisher = {IEEE},
isbn = {979-8-3503-2348-1},
}