Optimal Thermal Actuation for Mitigation of Heat-Induced Wafer Deformation - researchr publication authors

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Daniel W. M. Veldman, Rob H. B. Fey, Hans Zwart, Marc M. J. van de Wal, Joris D. B. J. van den Boom, Henk Nijmeijer. Optimal Thermal Actuation for Mitigation of Heat-Induced Wafer Deformation. IEEE Trans. Contr. Sys. Techn., 29(2):514-529, 2021. [doi]

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