Daniel W. M. Veldman, Rob H. B. Fey, Hans Zwart, Marc M. J. van de Wal, Joris D. B. J. van den Boom, Henk Nijmeijer. Optimal Thermal Actuation for Mitigation of Heat-Induced Wafer Deformation. IEEE Trans. Contr. Sys. Techn., 29(2):514-529, 2021. [doi]
@article{VeldmanFZWBN21,
title = {Optimal Thermal Actuation for Mitigation of Heat-Induced Wafer Deformation},
author = {Daniel W. M. Veldman and Rob H. B. Fey and Hans Zwart and Marc M. J. van de Wal and Joris D. B. J. van den Boom and Henk Nijmeijer},
year = {2021},
doi = {10.1109/TCST.2019.2948592},
url = {https://doi.org/10.1109/TCST.2019.2948592},
researchr = {https://researchr.org/publication/VeldmanFZWBN21},
cites = {0},
citedby = {0},
journal = {IEEE Trans. Contr. Sys. Techn.},
volume = {29},
number = {2},
pages = {514-529},
}