B. Viale, M. Fer, L. Courau, Philippe Galy, Bruno Allard. On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FD-SOI technology. Microelectronics Reliability, 64:101-108, 2016. [doi]
@article{VialeFCGA16,
title = {On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FD-SOI technology},
author = {B. Viale and M. Fer and L. Courau and Philippe Galy and Bruno Allard},
year = {2016},
doi = {10.1016/j.microrel.2016.07.076},
url = {http://dx.doi.org/10.1016/j.microrel.2016.07.076},
researchr = {https://researchr.org/publication/VialeFCGA16},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {64},
pages = {101-108},
}