Elisa Vianello, O. Thomas, M. Harrand, Santhosh Onkaraiah, T. Cabout, B. Traore, T. Diokh, Houcine Oucheikh, Luca Perniola, Gabriel Molas, Philippe Blaise, J.-F. Nodin, E. Jalaguier, Barbara De Salvo. Back-end 3D integration of HfO2-based RRAMs for low-voltage advanced IC digital design. In Proceedings of 2013 International Conference on IC Design & Technology, ICICDT 2013, Pavia, Italy, May 29-31, 2013. pages 235-238, IEEE, 2013. [doi]
Abstract is missing.