Joeri De Vos, Vladimir Cherman, Mikael Detalle, Teng Wang, Abdellah Salahouelhadj, Robert Daily, Geert Van der Plas, Eric Beyne. Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-7, IEEE, 2014. [doi]
Abstract is missing.