Chi Lok Wan, Toshifumi Ishioka, Chiaki Kanda, Keisuke Osawa, Kenji Kodama, Eiichiro Tanaka. Development of a 3-layer mechanism passive-type assistive suit for lower back and upper arm. In IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2022, Sapporo, Japan, July 11-15, 2022. pages 1237-1242, IEEE, 2022. [doi]
Abstract is missing.