Meilin Wan, Zhen Zhang, Yin Zhang, Zhangqing He, Haoshuang Gu, Kui Dai, Xuecheng Zou. A Chip-PCB Hybrid SC PUF Used for Anti-Desoldering and Depackaging-Attack Protection. J. Solid-State Circuits, 59(7):2330-2344, July 2024. [doi]
Abstract is missing.