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Ying Wang, Fei Cao, Minghui Ding, Dawei Yang. Investigation of Zr-N thin films for use as diffusion barrier in Cu metallization. Microelectronics Journal, 38(8-9):910-914, 2007. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Diffusion barrier performance of Zr-N/Zr bilayered film in Cu/Si contact systemYing Wang, Fei Cao, Minghui Ding, Yun-tao Liu. mr, 48(11-12):1800-1803, 2008. [doi]
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