Albert Z. Wang, Qi Chen, Cheng Li, Fei Lu 0004, Chenkun Wang, Feilong Zhang, X. Shawn Wang, Jimmy Ng, Ya-Hong Xie, Rui Ma, Li Wang, Lin Lin. More-Than-Moore: 3D heterogeneous integration into CMOS technologies. In 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Los Angeles, CA, USA, April 9-12, 2017. pages 1-4, IEEE, 2017. [doi]
@inproceedings{WangCLLWZWNXMWL17,
title = {More-Than-Moore: 3D heterogeneous integration into CMOS technologies},
author = {Albert Z. Wang and Qi Chen and Cheng Li and Fei Lu 0004 and Chenkun Wang and Feilong Zhang and X. Shawn Wang and Jimmy Ng and Ya-Hong Xie and Rui Ma and Li Wang and Lin Lin},
year = {2017},
doi = {10.1109/NEMS.2017.8016961},
url = {https://doi.org/10.1109/NEMS.2017.8016961},
researchr = {https://researchr.org/publication/WangCLLWZWNXMWL17},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Los Angeles, CA, USA, April 9-12, 2017},
publisher = {IEEE},
isbn = {978-1-5090-3059-0},
}