Ya-Hong Xie - researchr alias

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Viewing Publication 1 - 7 from 7

2017

TLP measurement and analysis of graphene NEMS switches for on-chip ESD protectionQi Chen, Cheng Li, Fei Lu 0004, Chenkun Wang, Feilong Zhang, Albert Z. Wang, Jimmy Ng, Ya-Hong Xie. nems 2017: 370-374 [doi]

Characterization of single-crystalline graphene ESD interconnectsQi Chen, Cheng Li, Fei Lu 0004, Chenkun Wang, Feilong Zhang, Tianru Wu, Xiaoming Xie, Kun Zhang, Xinxin Li, Jimmy Ng, Ya-Hong Xie, Yuhua Cheng, Albert Z. Wang. asicon 2017: 977-980 [doi]

Optimization of suspended graphene NEMS devices for electrostatic discharge applicationsJimmy Ng, Wei Zhang, Ya-Hong Xie, Qi Chen, Rui Ma, Albert Z. Wang. nems 2017: 364-369 [doi]

More-Than-Moore: 3D heterogeneous integration into CMOS technologiesAlbert Z. Wang, Qi Chen, Cheng Li, Fei Lu 0004, Chenkun Wang, Feilong Zhang, X. Shawn Wang, Jimmy Ng, Ya-Hong Xie, Rui Ma, Li Wang, Lin Lin. nems 2017: 1-4 [doi]

2015

TLP evaluation of ESD protection capability of graphene micro-ribbons for ICsWei Zhang, Qi Chen, Ming Xia, Rui Ma 0003, Fei Lu 0004, Chenkun Wang, Albert Z. Wang, Ya-Hong Xie. asicon 2015: 1-4 [doi]

2005

Three-dimensional impedance engineering for mixed-signal system-on-chip applicationsKyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Frank Chang, Ya-Hong Xie. cicc 2005: 663-666 [doi]

1998

An approach for fabricating high-performance inductors on low-resistivity substratesYa-Hong Xie, Michel R. Frei, Andrew J. Becker, Clifford A. King, D. Kossives, L. T. Gomez, S. K. Theiss. jssc, 33(9):1433-1438, 1998. [doi]

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