More-Than-Moore: 3D heterogeneous integration into CMOS technologies

Albert Z. Wang, Qi Chen, Cheng Li, Fei Lu 0004, Chenkun Wang, Feilong Zhang, X. Shawn Wang, Jimmy Ng, Ya-Hong Xie, Rui Ma, Li Wang, Lin Lin. More-Than-Moore: 3D heterogeneous integration into CMOS technologies. In 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Los Angeles, CA, USA, April 9-12, 2017. pages 1-4, IEEE, 2017. [doi]

Abstract

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