TSF3D: MSV-Driven Power Optimization for Application-Specific 3D Network-on-Chip

Kan Wang, Sheqin Dong, Fengxian Jiao. TSF3D: MSV-Driven Power Optimization for Application-Specific 3D Network-on-Chip. IEEE Trans. on CAD of Integrated Circuits and Systems, 36(7):1089-1102, 2017. [doi]

Abstract

Abstract is missing.