Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Chuei-Tang Wang, Jeng-Shien Hsieh, Victor C. Y. Chang, En-Hsiang Yeh, Feng-Wei Kuo, Hsu-Hsien Chen, Chih-Hua Chen, Ron Chen, Ying-Ta Lu, Chewnpu Jou, Hao-Yi Tsai, C. S. Liu, Doug C. H. Yu. Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]

This author has not been identified. Look up 'Chuei-Tang Wang' in GoogleThis author has not been identified. Look up 'Jeng-Shien Hsieh' in GoogleThis author has not been identified. Look up 'Victor C. Y. Chang' in GoogleThis author has not been identified. Look up 'En-Hsiang Yeh' in GoogleThis author has not been identified. Look up 'Feng-Wei Kuo' in GoogleThis author has not been identified. Look up 'Hsu-Hsien Chen' in GoogleThis author has not been identified. Look up 'Chih-Hua Chen' in GoogleThis author has not been identified. Look up 'Ron Chen' in GoogleThis author has not been identified. Look up 'Ying-Ta Lu' in GoogleThis author has not been identified. Look up 'Chewnpu Jou' in GoogleThis author has not been identified. Look up 'Hao-Yi Tsai' in GoogleThis author has not been identified. Look up 'C. S. Liu' in GoogleThis author has not been identified. Look up 'Doug C. H. Yu' in Google

runs on WebDSL