Chuei-Tang Wang, Jeng-Shien Hsieh, Victor C. Y. Chang, En-Hsiang Yeh, Feng-Wei Kuo, Hsu-Hsien Chen, Chih-Hua Chen, Ron Chen, Ying-Ta Lu, Chewnpu Jou, Hao-Yi Tsai, C. S. Liu, Doug C. H. Yu. Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.