Economizing TSV Resources in 3-D Network-on-Chip Design

Ying Wang, Yinhe Han, Lei Zhang, Binzhang Fu, Cheng Liu, Huawei Li, Xiaowei Li 0001. Economizing TSV Resources in 3-D Network-on-Chip Design. IEEE Trans. VLSI Syst., 23(3):493-506, 2015. [doi]

Abstract

Abstract is missing.