Y. W. Wang, Y. W. Lin, C. R. Kao. Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates. Microelectronics Reliability, 49(3):248-252, 2009. [doi]
@article{WangLK09-2,
title = {Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates},
author = {Y. W. Wang and Y. W. Lin and C. R. Kao},
year = {2009},
doi = {10.1016/j.microrel.2008.09.010},
url = {http://dx.doi.org/10.1016/j.microrel.2008.09.010},
tags = {C++},
researchr = {https://researchr.org/publication/WangLK09-2},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {49},
number = {3},
pages = {248-252},
}