The following publications are possibly variants of this publication:
- The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrateR. K. Shiue, L. W. Tsay, C. L. Lin, J. L. Ou. mr, 43(3):453-463, 2003. [doi]
- Development of SnAg-based lead free solders in electronics packagingLiang Zhang, Cheng-wen He, Yong-huan Guo, Ji-guang Han, Yong-wei Zhang, Xu-yan Wang. mr, 52(3):559-578, 2012. [doi]