Tong Hong Wang, Yi-Shao Lai, Yu-Cheng Lin. Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions. Microelectronics Reliability, 48(1):132-139, 2008. [doi]
@article{WangLL08-1,
title = {Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions},
author = {Tong Hong Wang and Yi-Shao Lai and Yu-Cheng Lin},
year = {2008},
doi = {10.1016/j.microrel.2007.02.011},
url = {http://dx.doi.org/10.1016/j.microrel.2007.02.011},
tags = {testing, reliability},
researchr = {https://researchr.org/publication/WangLL08-1},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {48},
number = {1},
pages = {132-139},
}