Yongsheng Wang, Fang Li, Hualing Yang, Yonglai Zhang, Yanhui Ren. 3D hybrid modeling of substrate coupling noise in lightly doped mixed-signal ICs. In IEEE 10th International Conference on ASIC, ASICON 2013, Shenzhen, China, October 28-31, 2013. pages 1-4, IEEE, 2013. [doi]
Abstract is missing.