Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs - researchr publication authors

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Kan Wang, Yuchun Ma, Sheqin Dong, Yu Wang, Xianlong Hong, Jason Cong. Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs. In Proceedings of the 16th Asia South Pacific Design Automation Conference, ASP-DAC 2011, Yokohama, Japan, January 25-27, 2011. pages 261-266, IEEE, 2011. [doi]

This author has not been identified. Look up 'Kan Wang' in GoogleThis author has not been identified. Look up 'Yuchun Ma' in GoogleThis author has not been identified. Look up 'Sheqin Dong' in GoogleThis author has not been identified. It may be one of the following persons:

Yu Wang

Look up 'Yu Wang' in GoogleThis author has not been identified. Look up 'Xianlong Hong' in GoogleThis author has not been identified. Look up 'Jason Cong' in Google

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