Kan Wang, Yuchun Ma, Sheqin Dong, Yu Wang, Xianlong Hong, Jason Cong. Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs. In Proceedings of the 16th Asia South Pacific Design Automation Conference, ASP-DAC 2011, Yokohama, Japan, January 25-27, 2011. pages 261-266, IEEE, 2011. [doi]
Abstract is missing.