Kan Wang, Yuchun Ma, Sheqin Dong, Yu Wang, Xianlong Hong, Jason Cong. Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs. In Proceedings of the 16th Asia South Pacific Design Automation Conference, ASP-DAC 2011, Yokohama, Japan, January 25-27, 2011. pages 261-266, IEEE, 2011. [doi]
@inproceedings{WangMDWHC11,
title = {Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs},
author = {Kan Wang and Yuchun Ma and Sheqin Dong and Yu Wang and Xianlong Hong and Jason Cong},
year = {2011},
doi = {10.1109/ASPDAC.2011.5722195},
url = {http://dx.doi.org/10.1109/ASPDAC.2011.5722195},
researchr = {https://researchr.org/publication/WangMDWHC11},
cites = {0},
citedby = {0},
pages = {261-266},
booktitle = {Proceedings of the 16th Asia South Pacific Design Automation Conference, ASP-DAC 2011, Yokohama, Japan, January 25-27, 2011},
publisher = {IEEE},
isbn = {978-1-4244-7516-2},
}