Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA - researchr publication authors

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Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai. Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. Microelectronics Reliability, 51(8):1372-1376, 2011. [doi]

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