Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai. Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. Microelectronics Reliability, 51(8):1372-1376, 2011. [doi]
@article{WangPLCL11,
title = {Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA},
author = {Tong Hong Wang and Sara N. Paisner and Chang-Chi Lee and Susan Chen and Yi-Shao Lai},
year = {2011},
doi = {10.1016/j.microrel.2011.03.025},
url = {http://dx.doi.org/10.1016/j.microrel.2011.03.025},
researchr = {https://researchr.org/publication/WangPLCL11},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {51},
number = {8},
pages = {1372-1376},
}