Zhenyu Wang, Jingbo Sun, A. Alper Goksoy, Sumit K. Mandal, Jae-sun Seo, Chaitali Chakrabarti, Ümit Y. Ogras, Vidya A. Chhabria, Yu Cao 0001. Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling. In 15th IEEE International Conference on ASIC, ASICON 2023, Nanjing, China, October 24-27, 2023. pages 1-4, IEEE, 2023. [doi]
Abstract is missing.