Precise 3D Calibration of Wafer Handling Robot by Visual Detection and Tracking of Elliptic-shape Wafers

Zining Wang, Masayoshi Tomizuka. Precise 3D Calibration of Wafer Handling Robot by Visual Detection and Tracking of Elliptic-shape Wafers. In 2020 IEEE International Conference on Robotics and Automation, ICRA 2020, Paris, France, May 31 - August 31, 2020. pages 4977-4982, IEEE, 2020. [doi]

Authors

Zining Wang

This author has not been identified. Look up 'Zining Wang' in Google

Masayoshi Tomizuka

This author has not been identified. Look up 'Masayoshi Tomizuka' in Google