Zining Wang, Masayoshi Tomizuka. Precise 3D Calibration of Wafer Handling Robot by Visual Detection and Tracking of Elliptic-shape Wafers. In 2020 IEEE International Conference on Robotics and Automation, ICRA 2020, Paris, France, May 31 - August 31, 2020. pages 4977-4982, IEEE, 2020. [doi]
@inproceedings{WangT20-13,
title = {Precise 3D Calibration of Wafer Handling Robot by Visual Detection and Tracking of Elliptic-shape Wafers},
author = {Zining Wang and Masayoshi Tomizuka},
year = {2020},
doi = {10.1109/ICRA40945.2020.9197150},
url = {https://doi.org/10.1109/ICRA40945.2020.9197150},
researchr = {https://researchr.org/publication/WangT20-13},
cites = {0},
citedby = {0},
pages = {4977-4982},
booktitle = {2020 IEEE International Conference on Robotics and Automation, ICRA 2020, Paris, France, May 31 - August 31, 2020},
publisher = {IEEE},
isbn = {978-1-7281-7395-5},
}