Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile

Tong Hong Wang, Ching-I. Tsai, Chang-Chi Lee, Yi-Shao Lai. Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. Microelectronics Reliability, 53(2):297-302, 2013. [doi]

Abstract

Abstract is missing.