Yong Wang, Hui Wu. Design high bandwidth-density, low latency and energy efficient on-chip interconnect. In 2017 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2017, Taipei, Taiwan, July 24-26, 2017. pages 1-6, IEEE, 2017. [doi]
@inproceedings{WangW17-43,
title = {Design high bandwidth-density, low latency and energy efficient on-chip interconnect},
author = {Yong Wang and Hui Wu},
year = {2017},
doi = {10.1109/ISLPED.2017.8009171},
url = {https://doi.org/10.1109/ISLPED.2017.8009171},
researchr = {https://researchr.org/publication/WangW17-43},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2017 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2017, Taipei, Taiwan, July 24-26, 2017},
publisher = {IEEE},
isbn = {978-1-5090-6023-8},
}