Design high bandwidth-density, low latency and energy efficient on-chip interconnect - researchr publication

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Yong Wang, Hui Wu. Design high bandwidth-density, low latency and energy efficient on-chip interconnect. In 2017 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2017, Taipei, Taiwan, July 24-26, 2017. pages 1-6, IEEE, 2017. [doi]

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