Xubo Wang, Qing Wang, Jia Zhou. Inverse RIE micro-loading in deep etching of silicon via array. In 13th IEEE International Conference on ASIC, ASICON 2019, Chongqing, China, October 29 - November 1, 2019. pages 1-3, IEEE, 2019. [doi]
@inproceedings{WangWZ19-24,
title = {Inverse RIE micro-loading in deep etching of silicon via array},
author = {Xubo Wang and Qing Wang and Jia Zhou},
year = {2019},
doi = {10.1109/ASICON47005.2019.8983664},
url = {https://doi.org/10.1109/ASICON47005.2019.8983664},
researchr = {https://researchr.org/publication/WangWZ19-24},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {13th IEEE International Conference on ASIC, ASICON 2019, Chongqing, China, October 29 - November 1, 2019},
publisher = {IEEE},
isbn = {978-1-7281-0735-6},
}