Inverse RIE micro-loading in deep etching of silicon via array

Xubo Wang, Qing Wang, Jia Zhou. Inverse RIE micro-loading in deep etching of silicon via array. In 13th IEEE International Conference on ASIC, ASICON 2019, Chongqing, China, October 29 - November 1, 2019. pages 1-3, IEEE, 2019. [doi]

Abstract

Abstract is missing.